Portfolio of proven technology blocks
Tronics offers a library of proven technology blocks, acquired through R&D programs and previous customer projects.
Thanks to 15 years of R&D, these technologies are now validated and associated to a large portfolio of processes suitable for the industry.
Electro-mechanical design capabilities:
Tronics co-designs electrostatic comb-driven spring-mass structures and capacitive membrane structures, thermal actuators as well as micro-mechanical structures and oscillators.
Wafer Level Packaging and interconnects:
Tronics proposes a complete set of hermetic and vacuum wafer level packaging with interconnection solutions to ease the manufacturing and integration of the MEMS it produces for its customers.
Tronics develops and industrializes specialized processes for custom devices. Tronics masters both surface and bulk micromachining technologies as well as thin and thick films processes.
Assembly and packaging
Tronics has in-house assembly and packaging capabilities and manages supply chain to deliver packaged and tested components to its customers.