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Portfolio of proven technology blocks

Tronics offers a library of proven technology blocks, acquired through R&D programs and previous customer projects.
Thanks to 15 years of R&D, these technologies are now validated and associated to a large portfolio of processes suitable for the industry.

Electro-mechanical design capabilities:

Tronics co-designs electrostatic comb-driven spring-mass structures and capacitive membrane structures, thermal actuators as well as micro-mechanical structures and oscillators.

Capacitive comb-drive structures
Thermal actuators
Micro-mechanics
Capacitive membranes

Wafer Level Packaging and interconnects:

Tronics proposes a complete set of hermetic and vacuum wafer level packaging with interconnection solutions to ease the manufacturing and integration of the MEMS it produces for its customers.

Vacuum WLP with vertical pads openings
Vacuum WLP with lateral vias
Hermetic WLP with TSVs
Vacuum WLP with TSVs and SMD solder bumps

Specialty processes

Tronics develops and industrializes specialized processes for custom devices. Tronics masters both surface and bulk micromachining technologies as well as thin and thick films processes.

Au plating surface micromaching
Bulk KOH or TMAH Micromachining
Bulk DRIE Micromachining


Gratings by nano-imprint lithography
Cu TSV
PolySi filled TSVs

Assembly and packaging

Tronics has in-house assembly and packaging capabilities and manages supply chain to deliver packaged and tested components to its customers.

MEMS assembly in high vacuum package (‹1mTorr)
MEMS and ASIC side-by-side assembly
Custom metal packages including titanium housings