Tronics is the recognized leader in applying advanced SOI MEMS micromachining technologies to the development and manufacturing of demanding custom commercial products. Available technologies are based on:

• Thick SOI High Aspect Ratio Micromachining (SOI H.A.R.M.) up to 1:30 aspect ratio in repeatable series manufacturing
• Surface micromachining on Epitaxied SOI wafers
• SOI bulk micromachining

Tronics’ expertise in applying Deep-Reactive Ion Etching (DRIE) on SOI technologies to MEMS structures includes:

• Capacitive High-Q factor resonating structures
• Capacitive and electrostatic surface and gap variation comb-drives
• Electrostatic vertical comb-drive actuators
• Stress-controlled, highly reflective single-crystal micro-mirrors
• SOI-gauge piezoresistors
• Cantilever-based microstructures on thin-SOI membranes
• Microfluidic devices with precise thickness and volume control

With nearly a decade of manufacturing extreme-performance and miniature sensors and actuators for demanding applications, Tronics has leveraged and capitalized on CEA-LETI’s 20 years of R&D background on SOI-MEMS technologies. Our intensive efforts at advanced engineering, qualification, characterization, manufacturability, SPC and reliability have lead us to our No. 1 position in the industry.

Tronics also offers MEMSOI, a Europractice-accredited Multi-Project Wafer (MPW) service on its proven 60µm thick SOI H.A.R.M. technology.