Our Capabilities

Our 2 MEMS facilities include over 2,300m² (25,000sq ft) of MEMS production, assembly, packaging, test and characterization areas. We offer a complete portfolio of equipment and process steps to fulfill an extensive range of development and custom process manufacturing requirements. Our two 6” wafer MEMS fabs excel at a variety of silicon, SOI and glass wafer processing capabilities:

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Design, Modelling and Simulation

  • Coventor MEMS Designer
  • Mentor Graphics
  • COMSOL Multiphysics (FEM)
  • Matlab Simulink
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Characterization

  • Automatic static and dynamic wafer probers
  • Product-specific characterization benches
  • High-precision position and rate table
  • Rotation stage for low-G accelerometer
  • Pressure sensor bench
  • Fluid flow characterization bench….
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Reliability Testing

  • Drop tower shock test (20,000G)
  • Centrifuge (26,000G)
  • Climatic chambers (T°, H°)
  • Vacuum packaging ageing bench
  • Bond tester (pull, push, shear and peel tests, tweezer)
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Planning, Traceability and Quality Control

  • Integrated MES (Manufacturing Execution System)
  • Production planning system
  • WIP tracking system
  • Traceability system from materials supply to final tests
  • FMEA methodologies and tools
  • SPC/QPC
  • Equipment and process Cp/Cpk controls
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Lithography

  • On-track resists coating and developing
  • Double-side alignment
  • Steppers
  • Proximity and contact photolithography
  • Shadow masks and lift-off processes
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DRIE Deep Dry Etching

  • Deep Reactive Ion Etching with ICP reactors (Bosch Process)
  • High Aspect Ratio (up to 1:30) DRIE Micromachining
  • Deep trench DRIE plasma etching
  • Laser drilling
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RIE and Plasma Etching

  • RIE: Si, PolySi, SiO2 and Si3N4 etching
  • O2 plasma etchers
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Wet Chemical Etching

  • Automatic Wet benches
  • KOH and TMAH Silicon etching
  • SiO2 and Si3N4 etching
  • HF sacrificial oxide release
  • Metal etching
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Thin Film Deposition and Electroplating

  • POCL3 Doped Poly
  • LPCVD: Thick Poly > 1µm, SiO2 and Si3N4
  • PECVD: SiO2 and Si3N4 low stress
  • TEOS and LOCOS
  • Sputtering and evaporation: Al,Cr, Au, Ti, TiN, W, Al, Cu, Ni, Pt…
  • Electroplating: Au, SnPb, FeNi, Ni, Cu…
  • Thin and thick PZT actuator deposition
  • Annealing and thermal treatment
  • Epitaxy and implantation (sub-contracted)
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Wafer Bonding

  • Silicon direct fusion bonding SDB
  • Eutectic bonding
  • Thermo-compression bonding
  • Glass Frit bonding
  • Anodic bonding
  • Low Temp Polymer sealing
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Metrology

  • Digital Holographic Microscopes (3D topography, dynamic behaviour…)
  • Scanning Electron Microscopes (SEM)
  • Surfscan, on wafer particles control
  • Profilometers
  • Optical and IR microscopes
  • Ultra-sonic, X-Ray, etc… through sub-contractors
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Wafer Level Testing

  • Automatic Electric Wafer Probers
  • Dynamic on wafer probers (pressure, gyro)
  • Impedance meter, 4 points probers
  • Wafer mapping software system
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Thinning, Grinding,
Polishing, Dicing

  • Wafer thinning
  • Grinding and Dry polishing
  • Chemical Mechanical Polishing (CMP)
  • Dicing of silicon and glass wafers
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Assembly and Packaging

  • Custom and Standard packages assembly
  • Pick and place die bonder
  • Automatic and manual wire bonder
  • Precision welder
  • High vacuum encapsulation with getter activation
  • Flip-Chip mounting
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Testing

  • Product- and application-specific tests
  • Static and dynamic dies test benches
  • Static and dynamic components test benches
  • Network analyser (Q factor, resonant and cut-off frequency…)
  • Anti-sticking burn-in test
  • Vacuum packaging ageing test
  • Microfluidics component tests