Guiding our customers from concept to implementation requires expertise, rigor and proven methodologies. Consequently, we have carefully assembled a team of talented industry veterans and leaders to reliably deliver on the commitments we make to our customers.
|Pascal LANGLOIS, Chief Executive Officer
Pascal joined Tronics in 2013 with more than 25 years of executive management experience in semiconductors. Most recently, he was Chief Sales and Marketing Officer at ST-Ericsson, and prior to that, Founder of NXP and Senior VP of Sales and Marketing. Pascal also worked with Philips Semiconductors BV, National Semiconductors, and VLSI Technology, where he held various executive management positions.
|Dr. Stéphane RENARD, Founder and CTO
Stéphane envisioned the market need for a manufacturer of custom components and founded Tronics in 1997 in response to industry requirements. He has years of experience in R&D in MEMS and optoelectronics and associated technology transfers.
|Laurence FAYAND, Chief Financial Officer
With 22 years of experience in Finance Management of high-tech companies, Laurence joined Tronics in 2013. From 2001-2013, she served as CFO for several start-ups : CYTOO, Beamind, Crocus Technology and Alditech. Prior to that, Mrs. Fayand worked for Hewlett Packard where she held various management positions in Cost Accounting and European Business Finance. Laurence holds a MBA from EM Lyon and a Master’s Degree in Finance and Accounting.
|Herve BORREL, Director of Sales & Marketing
Herve Borrel joined Tronics in 2010. He was previously the CEO of MicroChemical Systems SA, a supplier of MEMS based sensors to the automotive industry. Mr. Borrel also worked with Motorola, and HaemoneticsInc, a manufacturer of medical equipment. Based in Phoenix, AZ (USA), Mr. Borrel is also President of Tronics USA.
|Brian STEPHENSON, COO Dallas Operations
Brian brings 18+ years of engineering and management experience. Prior to joining Tronics Brian was Senior Engineering Manager at STMicroelectronics, managing teams working on high volume, integrated MEMS processes. He had also held various process engineering and management positions with TI, WaferTech and Ebara Technologies.