We are the first company to offer a qualified industrial technology of 60µm thick SOI High Aspect Ratio Micromachining featuring hermetic wafer level packaging in a MPW service.
This technology allows the fabrication of innovative structures such as:
- Capacitive sensors
- Electrostatic actuators
- High Q factor resonating structures
- Electrostatic optical structures
- Energy scavengers
- Microfluidics test structures
This service provides universities, research labs and companies with a Design Rules Manual and associated Software Design Kit based on the Coventor tool suite, enabling them to design their own structures and components. They can then submit their designs for production in regular low-cost runs. The result: continuous design improvement.
For each design submitted (one location), we deliver 20 dies, released and protected by a hermetic silicon wafer level package.
Chip Characteristics:
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Die sizes (mm2)
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4×4
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4×8
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8×8
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|---|---|---|---|
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Available active area (mm2) |
3.5×3.5
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3.5×7.5
|
7.5×7.5
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Number of pads or openings on the cap
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Up to 12
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Up to 18
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Up to 24
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+ From simple to most complex functions
+ Hermetically sealed or open access |
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Hermetic Wafer Level Packaging
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+ Industry state of the art standard for manufacturing
+ Protection and ease of handling/integration |
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SOI
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SOI = 60 µm BOX = 2 µm Bulk = 450 µm
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Release
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+ Structure released
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Planning of the Runs:
| Run | Order and first design submission
(GDSII format) |
Final design release
(GDSII format) |
Delivery date |
|---|---|---|---|
| N | April 1 | April 15 | July 15 |
| N+1 | October 1 | October 15 | January 15 |
Prices of the Runs:
Special pricing is available for universities and research labs.
| Die sizes | 4×4 mm | 4×8 mm | 8×8 mm |
|---|---|---|---|
| Academic price | 2,500 € | 3,500 € | 5,000 € |
| Corporate price | 3,750 € | 5,000 € | 7,500 € |
Additional Services:
100 € per additional die (min. quantities = 10 dies)
200 € per die without release and cap (min. quantities = 5 dies)
Training sessions are provided twice per year through the STIMESI organization, see www.stimesi.org for more information.
University and research lab members of the Europractice IC Service can also access the service through IMEC. For more information see www.europractice-ic.com.