Our in-house assembly capabilities and proven expertise in custom package development translate directly into targeted customer benefits. We qualify customized assembly and packaging solutions and build reliable supply chains for their components.

We respond to the competitive character of our high volume customers’ sectors with efficient facilitation of MEMS system integration. Advising customers on MEMS assembly best practices, we actively participate in reliability tests and the validation of their supply chain. Recognizing the vital importance of time to market, our high-end back-end line also offers fast turnaround for packaging prototypes and small volumes, to optimize and simplify the product development.

For OEMs we manufacture packaged and tested components – from wafer level packaged MEMS dice to integrated Systems in Package (SiP) – with standard or custom packaging. Taking full responsibility for both product and supply chain, we assure customers reliability and continuous quality improvement. Our service range for the components spans development, qualification, production ramp-up and regular manufacturing, including packaging, testing and calibration.