MEMS Technology

Tronics has been working with SOI for more than 10 years and is now the recognized technological leader in custom components on SOI.

100µm-thick DRIE on SOI with HF anti-stiction HF release
100µm-thick DRIE
on SOI with
HF anti-stiction release
Double-side DRIE on 100µm SOI
Double-side
DRIE on
100µm SOI
DRIE on 60-µm thick C-SOI
DRIE
on 60-µmthick
C-SOI

Tronics has a solid experience in the key MEMS technologies of surface, bulk and High Aspect Ratio Micromachining.

metal surface micromachining
Metal surface
micromachining
bulk KOH micromachining
Bulk KOH
Micromachining
Bulk DRIE Bulk Micromachining
Bulk DRIE
Bulk Micromachining

In addition, Tronics offers unique expertise in Wafer Level Packaging and Vacuum Wafer Level Packaging, making us the leader in manufacturing extreme performance sensors packaged under high vacuum.

water level pakaging
Wafer Level
Packaging
Specialized Assembly
Specialized
Assembly
High vacuum packaging
High Vacuum
Ceramic Packaging