Our 2 MEMS facilities include over 2,300m² (25,000sq ft) of:
MEMS production, assembly, packaging, test and characterization areas.
We offer one of the most complete portfolios of equipment and MEMS process steps in the industry to fulfill an extensive range of development and custom process manufacturing requirements. Our European and US waferfabs excel at a variety of silicon, SOI and glass wafer processing capabilities:
Front-end: Wafer processing
Wafer level Tests & In-line Contol
Back-end : MEMS & IC assembly and packaging
Component- level Test and calibration: